NXP Powers NFC in the Samsung GALAXY S III

May 16, 2012  

NXP Semiconductors N.V. announced that its PN65 Mobile Transactions solution will power the Samsung GALAXY S III bringing a new concept of human-centric mobile experience. The highly anticipated Samsung GALAXY S III is the successor of the best-selling Samsung GALAXY S II.

  Erik Meijer Promoted to President, Bourns Electronics

May 09, 2012  

Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced that Erik Meijer has been promoted to the newly created position of President, Bourns Electronics. In his new role, Meijer will be responsible for overseeing the company's various business segments. Meijer will report to Bourns, Inc. President and Chief Operating Officer, John Halenda, who has announced that he will retire in March 2013.

  Vishay Intertechnology's SiZ710DT 20 V N-Channel PowerPAIR® Power MOSFET Honored With 2012 China ACE Award

May 08, 2012  

Vishay Intertechnology, Inc. (NYSE:VSH) today announced that the company’s SiZ710DT 20 V n-channel PowerPAIR® power MOSFET has received a 2012 China Annual Creativity in Electronics (ACE) Award in the category of Power Devices/Voltage Converter.

  Power Integrations Found to Infringe Fairchild Semiconductor Patent Rights; Fairchild Files Additional Patent Lawsuit

May 08, 2012  

Fairchild Semiconductor (NYSE:FCS), a leading global supplier of high performance power and mobile products, today filed a new U.S. patent infringement lawsuit against Power Integrations, Inc. just days after a U.S. jury found Power Integrations infringed Fairchild U.S. patent claims covering primary side regulation technology.

  Molex Partners with Altera and Gennum to Demonstrate 100 Gbps Enabling Technology at OFC/NFOEC

May 02, 2012  

Test of 28 Gbps system provides the roadmap to next-generation interconnect technology LISLE, Ill. – Molex Incorporated will partner with Altera Corporation and Gennum Corporation to demonstrate interoperability of a 28 Gbps Very Short Reach (VSR) interconnect solution at OFC/NFOEC, March 6 – 8. The companies are using this opportunity to illustrate their commitment to helping system engineers and manufacturers develop higher density and lower power optical networks. The demonstration will take place during the Optical Internetworking Forum (OIF) Interoperability 2012 – Enabling High-Speed Dynamic Services multi-vendor showcase in booth 713.