Altera Chinese Forum is a platform for you to learn, share and exchange information of FPGA in design methodologies and technological experience within the broad engineering community in China. Whenever you want to raise question and get answer, seek help, advice, share martial, experience, meet with other technical professionals or contribute ideas to enhance one anothers learning experience with Altera products, you just need to visit here. Act now to register for free account and you could be a winner for portable hard disk, MP4 player, A4 digital photo printer and more. Please click here for details.
STMicroelectronics eDesign Studio is a software smart tool which greatly simplifies the task of engineers working on different application types: power supplies, LED driving, battery charger and photovoltaics. Simply fill in the high-level I/O specifications and select among the list of recommended ICs. You can then refine the suggested design based on the resources provided: fully annotated interactive schematics and BOM, Bode, power-loss and efficiency analysis, major voltage and current-waveform simulations, device datasheets and application notes. An efficient connection to Cadence Orcad PSpice makes the tool more powerful. Please click here and your design gets easier!
This report provides general information on purchasing trend of product segments including Analog, Discrete, Embedded, Logic, Connectors etc. Contact your local Arrow sales representative to find out how Arrow can help you manage inventory assets more effectively and increase your supply chain efficiency.
Cell phone manufacturers are increasingly pressed to provide status LEDs that can alert users to messages waiting, impending calendar appointments, and other notifications while the phone is in standby; indeed, several recent handset releases have received negative reviews for not having a notification LED. At the same time, users are demanding longer standby times from their phones. This pair of seemingly simple issues presents a surprisingly difficult dilemma to manufacturers: how can they power notification LEDs while keeping total standby consumption low?
Design recommendation for battery backed applications using a Cypress MoBL SRAM (also called as Ultra Low power SRAM) and a microprocessor supervisory chip is explained in this document. The technique described here ensures better data integrity in SRAM when compared to legacy design technique in case of power failures in a battery backed application.
What is more annoying, running out of battery or constantly needing to recharge it? With the proliferation of cellular mobile handsets, especially smartphones in the world today where people are connected 24 hours a day, 7 days a week, consumers cant seem to get enough of the voice calls, emails, text messages and surfing the web. All of this activity on our mobile handsets consumes battery life and with this constant use, phones can go to that dreaded one bar on the battery power indicator very quickly.
In June 2011, International Data Corporation (IDC) expected that the total smartphone sales in 2011 will reach 472 millions across the globe, rising to 982 millions in 2015. However, they reported on 3 Nov 2011 that 118 millions of smart phones were sold worldwide in Q3 2011 as compared to 82.8 million units in the 3Q10. It grew 42.6% despite a slowdown within key mature markets.
The largest market in terms of volumes and with highest number of applications on a single platform today isthat of mobile phones. With more than 1.5 Billion phones being shipped in a year worldwide, many globalplayers are competing against each other to capture a majority share of this market. The major wireless applications in a mobile phone include primarily cellular communication, WLAN, GPS, FM, mobile TV etc.
Board space within the Wireless Hand Held Device Industry is always a premium. Available space to support an antenna interconnect was only 3.0mm by 1.0mm with a working height of 0.90mm. Material overstressing, component stability on the board, and achieving high hertz forces were potential concerns.
The portable power application space is broad and diverse. Products range from wireless sensor nodes that consume average power measured in microwatts to cart-based medical or data acquisition systems with multi-hundred watt-hour battery packs. However, despite this variety, a few trends emerge - designers continue to demand more power in their products to support increased functionality and look to charge the battery from any available power source.
This application note addresses the problem of Electro Magnetic Interference (EMI) self- pollution in which one part of an electrical system such as cell phones and consumer electrical products emit radiation that interferes with the operation of other parts of the system. After discussing the causes of EMI self-pollution and how systems are tested for EMI it will be demonstrated that the choice of ON Semiconductor EMI filters with integrated ESD protection provide better immunity from EMI self-pollution than competing ceramic products.
Solar power is one of the widely available energy sources. It has been in focus worldwide andsolar installations of capacities in megawatts order are reality today. The efficiency of the solarpanels remains low even today and the requirement of ensuring highest efficiency outside the panelremains stringent. Thanks to this, several techniques have been deployed to harness the maximum energy, Maximum Power point tracking being one of them.
TE Circuit Protections ChipSESD devices feature a surge rating of 2A under 8x20s surge and an ESD rating of 10kV contact discharge. The devices low-leakage current (1.0A max) reduces power consumption and a fast response time (1ns) helps equipment to pass IEC61000-4-2, level 4 testing. Their input capacitance of 4.0pF (0201 package) and 4.5pF (0402 package) makes them suitable for a wide variety of mobile device applications.
Given that todays Smartphone integrates features like personal organizers and email management tools with basic multimedia and handset capabilities, the typical ON time is more crucial to the end users than that of an entry level mobile phone. The feature set drives the need for high processing power, larger (brighter) displays, touch screen controls and speaker phone capability. To meet performance and form factor requirements of the phone, careful consideration to the supply current and package sizes is important.
Power engineers today face a major challenge as the increasing functionality and shrinking size of commercial electronic products leaves less and less room for power circuitry. One way of meeting this challenge is by leveraging advancements in MOSFET silicon technology and packaging. With higher-performance silicon now available in smaller-size packages, the industry has seen a shift from standard leaded packages like SO-8s to power packages with bottom side drain pads.
MALVERN, Pa. — Dec. 12, 2011 — Vishay Intertechnology, Inc. (VSH: NYSE) today announced that th... >more
Dr. Mike Peng Li Recognized for His Contributions to the Design of Jitter Test Technologies San ... >more
SAN JOSE, Calif. – December 20, 2011 – Fairchild Semiconductor (NYSE: FCS), a leading global su... >more
With over 30 years of experience in designing and developing embedded computing and power products,... >more
Buoyed by the release of Android 4.0 and Windows 8 operating systems, tablet PCs will dominate the ... >more
2011 saw two major, devastating natural disasters: Japan's earthquake and tsunami in March and, mos... >more
IHS Inc. has released the details of its research that describes a vibrant forecast for ICs used in... >more
According to IHS Inc., stockpiles from semiconductor suppliers fell in Q3, ending inventory accumul... >more
NXP USB microcontrollers and JenNET-IP recognized in 2011 EDN Hot 100; EDN China Innovation Awards ... >more
About This E-Newsletter
This e-newsletter is published by Arrow Asia Pac Ltd. This newsletter aims to provide news and information to support the business and technology needs of semiconductor executives and professionals in Asia Pac.